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4605-HTR
4605-HTR is designed to test the leadless devices diced on the UV film of the wafer ring such as QFN, BGA, and WLCSP.
This high speed die sorter picks up non-defective devices from the film based on the MAP file measured in the front-end
process, performs the 6 dimensional visual inspection, and then store them to embossed carrier tapes.
As a high-speed sorting machine compatible with the wafer ring size of up to 12 inches, it helps to achieve a significant
improvement in the efficiency of inspection process. Equipped visual inspection and handling systems satisfy the stringent
standard of WLCSP and Wettable Flank-plated QFN. Proven track records of this handler include the contributions to the
automotive semiconductor and the installation to the class 10000 cleanrooms (ISO 7).
Feature
♦ High Throughput (30,000 UPH)
♦ Easy device management with recipes
♦ Good for High-Mix Low-Volume Manufacturing. 
♦ No Conversion kit is needed if package change is slight.
Even if really required, it'll be very minimum effort.
♦ Support Automatic calibration function.
♦ One output tape only with ARC as an option.
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Model
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4605-HTR
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Applicable Package
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WLCSP, WLP, QFN, DFN, CSP, BGA, BCC, LLP, Bare die,
KGD (Known Good Die), TD (Tested die)
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Applicable Ring Size
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6 / 8 / 12 inch
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package size
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0.5×0.5 to 8×8 mm |
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Throughput (pcs/hr)*
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30,000
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Cycle Time (s/pc)
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0.12(include 50mS vision time)
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Feeding
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1 cassette (25 wafer rings for 8 inch)
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Sorting
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Bin, 1 X Tape Out with ARC option
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Vision Inspection system
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6side, In-Pocket, Post Seal
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* Please contact us for the detail specification.
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* Theoretical throughput exclude time for ring replacement and value may differs depend on device matrix
on strip.
   
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